- 您现在的位置：买卖IC网 > Sheet目录530 > UPG2027TQ-EVAL (CEL)EVAL BOARD FOR UPG2027TQ
UPG2027TQ
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales of?ce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Re?ow
VPS
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of re?ow processes
Maximum chlorine content of rosin ?ux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200 ° C or higher
Preheating time at 120 to 150 ° C
Maximum number of re?ow processes
Maximum chlorine content of rosin ?ux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of ?ow processes
Maximum chlorine content of rosin ?ux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin ?ux (% mass)
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215 ° C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
: 120 ° C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
VP215
WS260
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
11/12/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
UPG2030TK-E2-A
IC SWITCH SPDT 6-MINIMOLD
UPG2031TQ-A
IC SWITCH SP3T 10-TSON
UPG2035T5F-E2-A
IC SWITCH DPDT 12-QFN
UPG2118K-EV24-A
EVAL BOARD UPG2118K
UPG2150T5L-EVAL-A
ISM DEVELPMT/PROTOTYPE EQUIP KIT
UPG2151T5K-E2-A
IC SWITCH SPDT 6-TSSON
UPG2155TB-E4-A
IC SWITCH SPDT 6-SMINI
UPG2156TB-E4-A
IC SPDT 800MHZ-2.5GHZ 6-MINIMOLD
相关代理商/技术参数
UPG2030TB
功能描述:RF 开关 IC RO 551-UPG2030TB-A RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel
UPG2030TB-A
功能描述:RF 开关 IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel
UPG2030TB-E3
制造商:California Eastern Laboratories (CEL) 功能描述:RF Switch SPDT 500MHz to 2.5GHz 20dB 6-Pin SOT-363 T/R
UPG2030TB-E3-A
功能描述:RF 开关 IC L S Band SPDT Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel
UPG2030TK
功能描述:RF 开关 IC RO 551-UPG2030TK-A RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel
UPG2030TK_1
制造商:NEC 制造商全称:NEC 功能描述:L, S-BAND SPDT SWITCH
UPG2030TK-A
功能描述:RF 开关 IC SPDT Dual Switch RoHS:否 制造商:M/A-COM Technology Solutions 开关数量:Single 开关配置:SPDT 介入损耗:0.6 dB 截止隔离（典型值）:43 dB 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PQFN-16 封装:Reel
UPG2030TK-E2
制造商:California Eastern Laboratories (CEL) 功能描述:RF Switch SPDT 500MHz to 3GHz 20dB 6-Pin LeadLess Mini-Mold T/R